Chemical Mechanical Planarization (CMP)
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The primary material used in the fabrication of integrated circuits is silicon. The quality of the integrated circuit depends directly on the quality of the silicon wafer. A progression of processes is needed to manufacture the highest quality silicon wafers. Perhaps the most critical stage is the Chemical Mechanical Planarization (or polishing) process. CMP is the process of combining chemical and mechanical forces to smooth and flatten silicon wafers. The Cordis high-resolution electronic pressure regulator provides pressure to a pneumatic cylinder which applies force on the wafer against the polishing pad. Cordis is ideal for this process because the dual-proportional valves can maintain exact pressure levels by reacting to subtle changes in force to relieve or exhaust pressure in real-time.
Related Content
- White Paper: Resolution in Proportional Control
- White Paper: Digital vs. Analog Control in Proportional Applications
- Cordis Series High Resolution Proportional Pressure Controls
- Cordis Pressure Controls FAQ
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